FD-S400 electronic scanning thermal inspection utilizes the latest microprocessor technology to ensure accurate and reliable inspection.  Scanning thermal detection adopts the method of comparing the hot metal signal with the background thermal radiation signal, so no matter it is static red hot iron filings or dynamic water mist and steam, the instrument will not be triggered by mistake.  In addition, lens smudges do not raise trigger levels.  

   This scanning thermal inspection uses a digitally scanned germanium diode array, a new technology that eliminates the need to maintain rotating parts and improves the reliability and accuracy of the scanning.  The traditional static simulation thermal detection is to use a photodiode to simply detect the infrared signal beyond the set threshold, easy to receive water mist and field background thermal radiation.